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Samsung Demonstrates Ultra-High Capacity Dense Packaging Technology, Achieving 4TB per Chip
7 hour ago /
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Author：小编
Samsung today unveiled its latest roadmap for ultra-high-density solid-state drives (SSDs), announcing plans to launch a 256TB sixth-generation E3.S form factor SSD by 2027 using ultra-dense packaging technology. Currently, Samsung has matured its 16-die packaging technology, while the new-generation 32-die packaging technology achieves a single-chip capacity of 4TB by stacking 32 1Tb QLC dies, doubling the overall drive capacity. The fifth-generation E3.S products offer a capacity of 128TB, which will be upgraded to 256TB in the sixth generation, featuring thinner, wider, faster, and denser characteristics.
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