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The Peking University team has made progress in reporting the thermal conduction mechanism of doped semiconductors in APR
21 hour ago /
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Author：小编
Doping, which modifies the electrical properties of semiconductors by introducing specific elements, is a core technology in semiconductor manufacturing. As chips evolve towards 3D stacking and high-power, high-frequency directions, heat dissipation has become a critical bottleneck. High power density leads to concentrated local hotspots, while the thinning of silicon wafers further impedes thermal conduction, making traditional heat dissipation solutions inadequate to meet the demands. The industry is exploring novel thermal management materials, interface engineering optimization, and advanced thermal characterization techniques to overcome heat dissipation limitations and support the development of next-generation chip technologies.
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