Zheng Li, who serves as President of the Integrated Circuit Industry Alumni Association at Tianjin University and as Director and CEO of JCET, delivered a keynote address at SEMICON China 2026. His speech, titled "Atomic-Level Innovation in Advanced Packaging Defines a New Paradigm for Chip Final Manufacturing," highlighted a pivotal shift in the semiconductor industry. Zheng explained that advanced packaging is now undergoing a precision revolution at the atomic level, transitioning the industry’s focus from simply scaling transistors to emphasizing system-level integration, interconnect efficiency, and comprehensive energy efficiency improvements.

Zheng underscored that atomic-level packaging significantly boosts system performance by refining critical factors such as alignment accuracy, interconnect density, surface roughness, and interfacial gaps. These enhancements are vital for supporting the ongoing revolution in AI computing power. He also pointed out that the integration of AI tools in chip manufacturing has become essential, facilitating better yield control and process optimization.

Furthermore, Zheng noted that atomic-level packaging technology enables the expansion of AI system capabilities, such as enabling ultra-large-scale interconnections among thousands of AI chips. He expressed his belief that advanced packaging will be central to industry evolution in the post-Moore’s Law era, steering the industry toward a new ecosystem focused on system-level integration and scalability.