Musk Officially Announces the Largest Chip-Making Plan in History: Annual Computing Capacity of 1 Terawatt for Robotics, Space AI Projects, and More
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Author:小编   

On March 22 local time, Tesla CEO Elon Musk announced on the X platform that Tesla and SpaceX have jointly launched the Terafab project, a 2-nanometer wafer fab located in Austin, Texas, USA, as the core of their vertical integration strategy for computing power. The project aims to serve electric vehicles, humanoid robots, and space AI infrastructure, with an annual computing capacity target of 1 terawatt, of which approximately 80% will be used for space and 20% for ground applications. Terafab will integrate the full process of logic chips, memory chips, and advanced packaging, featuring two wafer fabs focused on different chip designs. Musk stated that current global chip production capacity cannot meet the computing power demands of Tesla, SpaceX, and xAI, prompting the push for a self-research and self-manufacturing strategy. The project is expected to involve a total investment of $20 to $25 billion, with the first batch of mass-produced chips scheduled to start production in 2027.