On the interactive platform, Zhongtian Decoration explicitly clarified that Corelsius Semiconductor Technology (Dongyang) Co., Ltd. is not engaged in the PCB board business. Instead, its core focus lies in FCBGA high-end packaging substrates. These substrates are specifically designed for packaging high-performance computing chips, including TPUs, CPUs, GPUs, and AI chips. They serve as a crucial intermediary that connects these chips to PCBs.
