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Micron Announces Mass Production of HBM4 High-Bandwidth Memory, SOCAMM2 Memory Modules, and PCIe 6.0 Enterprise-Grade SSDs
3 day ago /
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Author：小编
At NVIDIA GTC 2026, Micron Technology announced the high-volume mass production of three key products tailored for data centers and AI workloads, all serving NVIDIA's next-generation Vera Rubin platform. Among them, the 12-layer stacked, 36GB HBM4 high-bandwidth memory, specifically designed for the NVIDIA Vera Rubin chip, has garnered significant attention, with large-scale shipments commencing in the first quarter of 2026.
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