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【IC Expo】The 'Process Packaging and Testing Session' of the Global Analyst Conference Cracks the Core Code of the Midstream Semiconductor Sector
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Author：小编
From September 9 to 11, 2026, Part 2 of the Global Semiconductor Analyst Conference, themed 'Midstream Manufacturing and Packaging & Testing,' will focus on the core links and technological divides in chip manufacturing. It will cover six major topics: competition between advanced and mature processes, lithography technology, wafer foundry, Chiplet and 3D packaging, global layout, cost control, and yield improvement, providing a platform for exchange across the entire value chain.
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