On March 10, 2026, IBM and semiconductor equipment maker Lam Research unveiled a five-year cooperative pact. Under this agreement, both entities will harness the power of High Numerical Aperture Extreme Ultraviolet (High NA EUV) lithography technology, coupled with Lam Research's innovative Aether dry photoresist technology. Their joint mission is to pioneer the materials and manufacturing processes essential for propelling logic chip fabrication into the sub-1 nanometer realm. This collaborative endeavor will unfold at IBM's Nanotechnology Center in Albany, New York, centering on cutting-edge semiconductor materials, sophisticated etching and deposition techniques, as well as the co-development of High NA EUV lithography technology. The overarching goal is to surmount the prevailing technological barriers in semiconductor fabrication and secure a commanding position in the evolution of the next-generation semiconductor sector.