A research report released by Sinolink Securities highlights that chemical mechanical polishing (CMP) plays a pivotal role in achieving global uniform planarization of wafers during integrated circuit manufacturing. This process finds application across various stages, including silicon wafer production, wafer fabrication, and advanced packaging.

As the domestic semiconductor industry expands its production capacity, makes strides in advanced process technologies, explores new materials and processes, evolves advanced packaging methodologies, and extends CMP polishing products to encompass upstream raw materials, the market potential for domestic CMP enterprises is anticipated to grow substantially.

It is, therefore, prudent to keep a close watch on industry frontrunners such as Anji Technology and Dinglong Co., Ltd., along with other companies that are steadily making inroads into the CMP market.