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SK Hynix Makes Progress in New HBM Packaging Tech, Potentially Shrinking DRAM Layer Gap
2 day ago /
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Author：小编
As reported by ZDnet, SK Hynix is forging ahead with a groundbreaking innovation in packaging technology, with the goal of boosting the stability and performance of HBM4. The key strategies revolve around thickening the DRAM and minimizing the spacing between DRAM layers. At present, this technology is undergoing the verification process. Should it achieve successful commercialization, it will significantly bridge the performance disparity in DRAM for HBM4 and upcoming products.
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