ASML, the global behemoth in photolithography, has unveiled its strategic blueprint for the next 10 to 15 years. The goal is to transcend its sole focus on EUV photolithography and make a foray into the advanced packaging equipment market. This strategic pivot is driven by a desire to surmount the physical size constraints inherent in chip manufacturing and offer partners 'stacked computing power' solutions. Technologically, ASML is transitioning from 'planar printing' to 'vertical interconnection', with the intention of harnessing its accumulated technological prowess to develop cutting-edge equipment. Concurrently, ASML is undergoing an 'intelligent' transformation, fine-tuning its software through AI and broadening its product range. At present, investors are bullish on its transformation prospects, and the company's market value has skyrocketed to $560 billion. Some analysts have noted that ASML's entry into the advanced packaging domain will redefine the parameters of 'chip manufacturing' and set the stage for the AI computing power competition in the coming decade.