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On March 3, Pioneer Precision made a public announcement detailing its intention to issue convertible bonds, with the aim of raising funds capped at 750 million yuan. Following the deduction of issuance-related expenses, the proceeds from this bond issue will be strategically allocated across several key initiatives. These include the expansion project focused on metal devices integral to core processes within advanced semiconductor manufacturing, the initiation of a new project centered on the research, development, and production of non-metallic materials and devices essential for the same core processes, the advancement of a research and development endeavor for ceramic electrostatic chucks utilized in semiconductor equipment, as well as bolstering the company's working capital reserves.
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