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Reportedly, ASML Intends to Expand Chip Manufacturing Equipment into the Advanced Packaging Domain
12 hour ago /
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Author：小编
As per reports, ASML is set to harness the power of AI to elevate the performance and production velocity of its tools. The company aims to extend its chip manufacturing equipment into the realm of advanced packaging and devise tools for multi-chip integration, thereby seizing additional business prospects in the burgeoning AI chip market.
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