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Broadcom: 1 Million 3D Stacked Chips to Be Sold by 2027, Utilizing 2nm/5nm Technology
1 day ago /
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Author：小编
Broadcom anticipates shipping 1 million 3D stacked chips by 2027. This technology enhances data transmission speeds, providing customers with high-performance, low-energy-consumption chips. Currently, Broadcom has emerged as a strong competitor to NVIDIA and AMD. TSMC is manufacturing these chips using its advanced 2nm process and integrating them with 5nm chips.
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