On February 24, the listing committee of the Shanghai Stock Exchange gave the green light to SJSemi Semiconductor Co., Ltd.’s application for an Initial Public Offering (IPO) on the STAR Market. If the issuance proves successful, SJSemi will make history by becoming the first A-share listed company with wafer-level advanced packaging as its core business. The company has outlined plans to raise 4.8 billion yuan, which will be earmarked for projects including 3D multi-chip integrated packaging. Notably, SJSemi exhibits a relatively high degree of customer concentration, with sales revenue derived from its top five customers accounting for a substantial 90.87% in the first half of 2025.
