Malaysia Allocates 180 Million Ringgit for Advanced Packaging Alliance, Fostering High-Value Transformation in Semiconductor Sector
14 hour ago / Read about 0 minute
Author:小编   

The Malaysian government, in collaboration with the private sector, is set to invest 180 million ringgit (around SGD 58 million) to establish an Advanced Packaging Technology Alliance. This initiative is designed to master critical technologies within a two-year timeframe and facilitate the semiconductor industry's shift from backend processing to more lucrative, high-value-added frontend segments.