There's a possibility that the chips in MediaTek's Dimensity series will be manufactured by Intel, with expectations to leverage Intel's 14A manufacturing process. Previously, Apple has tentatively planned to adopt Intel's 18A process, with the potential to utilize the 18A-P variant for its entry-level M-series chips. Shipments of these chips are anticipated as early as 2027. Moreover, the customized ASIC set to debut in 2028 will incorporate Intel's EMIB (Embedded Multi-die Interconnect Bridge) packaging technology. To facilitate this, Apple has already entered into a non-disclosure agreement to secure 18A-P process PDK (Process Design Kit) samples for evaluation purposes. Notably, Intel's 18A-P process supports Foveros Direct 3D hybrid bonding technology, a cutting-edge approach in chip design.

However, the utilization of Intel's 14A process for MediaTek's mobile chips presents certain challenges. Specifically, the backside power delivery technology employed in this process can lead to self-heating effects, which may impact chip performance. If MediaTek and Intel can successfully navigate and overcome this technical bottleneck, it could pave the way for deeper and more extensive collaboration between the two tech giants.