Search
Collaboration Fuels Breakthroughs: Tsinghua University's School of Integrated Circuits Advances in Flexible Electronics and Edge AI Chips
8 hour ago /
Read about 0 minute
Author：小编
Under the leadership of Professor Ren Tianling, the research team at the School of Integrated Circuits, Tsinghua University, has successfully developed the FLEXI flexible digital in-memory computing chip. Leveraging low-temperature polysilicon CMOS technology, this innovative chip stands out for its lightweight construction, cost-effectiveness, and remarkable energy efficiency. Notably, it can endure more than 40,000 bends without any compromise in performance and maintains stable operation even in harsh environmental conditions. This achievement paves the way for the widespread adoption of flexible electronic devices in mobile healthcare, embedded intelligence, and other cutting-edge fields.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
