On February 3, 2026, in the midst of a worldwide scarcity of storage chips, two of China's foremost storage chip powerhouses, ChangXin Memory Technologies (CXMT) and Yangtze Memory Storage International (YMTC), have embarked on their most extensive expansion endeavors to date. CXMT is in the process of erecting a brand-new factory in Shanghai. The anticipated increase in production capacity at this new site is projected to be two to three times greater than that of its Hefei headquarters. Production at this new facility is slated to kick off in 2027, with the output encompassing a wide range of products, including those for servers, PCs, automotive electronics, and various other sectors. Moreover, the company is ramping up its High Bandwidth Memory (HBM) production lines to cater to the burgeoning demands of AI computing. In the meantime, YMTC is constructing its third factory in Wuhan, which is also on track to commence production in 2027. Beyond its existing NAND production, 50% of the new factory's production capacity will be earmarked for DRAM manufacturing. Furthermore, it will engage in collaborative efforts with local enterprises on HBM research and development. Both firms are driven by the objective of closing the gap with international frontrunners and capitalizing on emerging market opportunities.