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Advanced Packaging Market Expands Annually by 9.4%, 2.5D/3D Packaging Sees Explosive Growth Fueled by AI Demand
1 week ago /
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Author：小编
As Moore's Law nears its inherent physical constraints, advanced packaging has stepped in to take the place of traditional process scaling, becoming the pivotal force in boosting semiconductor performance and spurring industry growth. In this era dominated by artificial intelligence-driven computing power, data centers, and innovative architectures, packaging technology is transitioning from a supporting role to a central position in driving industrial value creation. Citing data from Yole, the advanced packaging market is poised to enter a strategic growth phase, projected to achieve a compound annual growth rate of 9.4%, ultimately reaching a market size of approximately $80 billion by 2030.
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