As high-performance computing, 5G communication, and third-generation semiconductor (e.g., GaN) power devices experience rapid development, chip power densities have soared, with local heat flux densities surpassing one kilowatt per square centimeter. Traditional silicon-based heat dissipation technologies are constrained by silicon's low thermal conductivity. Under conditions of high heat flux, they result in substantial spreading thermal resistance, posing challenges in meeting the heat dissipation demands of next-generation high-power electronic devices. Diamond, often hailed as the "ultimate heat dissipation material" owing to its exceptional thermal conductivity, currently grapples with a significant hurdle in thermal management: how to effectively integrate it with efficient embedded microfluidic cooling architectures, such as manifold microchannels, to fully harness its heat dissipation capabilities.