With the rapid development of high-performance computing, 5G communications, and third-generation semiconductor (e.g., GaN) power devices, chip power density has surged dramatically, with local heat flux density exceeding one kilowatt per square centimeter. Traditional silicon-based heat dissipation technologies are limited by the low thermal conductivity of silicon, resulting in significant spreading thermal resistance in high heat flux scenarios and making it difficult to meet the heat dissipation requirements of next-generation high-power electronic devices. Diamond, known as the ultimate heat dissipation material due to its high thermal conductivity, poses a significant challenge in the current field of thermal management: how to integrate it with efficient embedded microfluidic cooling architectures (such as manifold microchannels) to fully unleash its heat dissipation potential.