Recently, the commencement and operational launch ceremony for key projects slated for January 2026 in Shanghai's Lingang Special Area took place at the main venue of the Yuanchuang Kexin Pilot Project. The ceremony followed a “1+2+1” format, with the primary venue set at the “Semiconductor Core Components and Systems Project” site.

Situated in the Dongfang Xin Gang plot, this project has received an investment of 5 billion yuan from Shanghai Yuanchuang Kexin Semiconductor Co., Ltd. Spanning approximately 108 acres and boasting a total construction area of 150,000 square meters, it will mainly establish standard production lines for MFC, gas cabinets, and other related products. The project is anticipated to be finished and operational within 18 months, achieving full production capacity within three years post-operation, with an expected annual output value of roughly 9.35 billion yuan.

Concurrently, the advanced packaging project, backed by a total investment of 3.6 billion yuan from Shanghai E-beam Semiconductor Co., Ltd., has also officially kicked off. This project zeroes in on the realms of advanced semiconductor packaging and testing, striving to tackle challenges such as inadequate technological transformation within the industry.

Furthermore, projects like the Shuyuan Town Health Service Center and the Wanzhen New Energy Safety Technology Headquarters have also commenced simultaneously. These projects span multiple sectors, encompassing both industry and social livelihood. The cumulative investment in the newly initiated projects stands at approximately 13.6 billion yuan.