During an investor conference call, Guangli Technology disclosed that its 12-inch high-precision dicing machine, Model 8231, is well-suited for ultra-thin wafers. This equipment supports both full-cut and DBG (Dice Before Grind) half-cut processes, catering to a variety of applications, including data internet scenarios in computing centers and compactly packaged wearable devices. Presently, both the 8231 model and the 7260 model, which is designed for efficient package dicing and sorting, have reached the client verification phase.

Moreover, the 12-inch laser grooving machine and the 12-inch grinder are also undergoing rigorous client-side verification, with encouraging feedback received thus far. The company is intensifying its research and development efforts on an 8-inch laser stealth dicing machine and an integrated grinding and polishing machine. It aims to expedite the equipment verification process in order to secure sales orders at the earliest opportunity.