On January 23, the official WeChat account of Henan Provincial Department of Science and Technology made an announcement: heat sink wafers, a novel application of diamond materials, have made a successful foray into the realm of high-end chip cooling. According to Huanghe Whirlwind, these heat sink wafers can be precisely cut into the required shapes and then affixed to chips, forming top-notch coolers. This innovation substantially boosts the performance of high-power devices, 5G/6G communication systems, and AI computing capabilities. At present, Huanghe Whirlwind has broken through the limitations of industrial-scale dimensions and successfully developed the largest 8-inch heat sink wafer that can be mass-produced within China. The production workshop for these wafers is slated to commence mass production in February of this year, heralding the transition of functional diamonds from laboratory research to large-scale commercial deployment.