At the NEPCON Japan 2026 exhibition, Intel made its debut of a groundbreaking prototype—a massive glass-core substrate integrated with EMIB (Embedded Multi-die Interconnect Bridge) technology. This innovative substrate measures an impressive 78mm×77mm. EMIB technology functions akin to a "high-speed overpass" within the substrate, seamlessly connecting adjacent chiplets (small, modular chips). As AI chip sizes inch closer to the field-of-view limitations of lithography machines, traditional organic resin substrates face physical constraints. In stark contrast, glass materials, boasting a thermal expansion coefficient akin to that of silicon chips and exceptionally smooth surfaces, have emerged as the ideal foundation for carrying next-generation ultra-large computing power chips.

The substrate employs a sophisticated "10-2-10" stacking architecture, leveraging an 800μm "thick core" design to bolster mechanical rigidity. This design enables an ultra-fine bump pitch of 45μm and successfully integrates two EMIB bridges. Intel asserts that it has overcome the inherent brittleness of glass, ensuring reliability at the production level. This achievement paves the way for more robust and high-performance AI chips in the future.