The research team, headed by Peng Huisheng, an academician at the Chinese Academy of Sciences, and Chen Peining, a professor from Fudan University, has triumphantly crafted a fiber chip after years of dedicated research. Their remarkable findings have been published in the esteemed journal Nature. Since 2008, this team has honed in on the realm of fiber devices. In 2020, they embarked on a fresh quest and ultimately managed to construct high-density integrated circuits within soft fibers, successfully creating the fiber chip.

This chip stands out with its high integration density of electronic components, multifaceted functions, and outstanding flexibility. Throughout the research and development journey, the team cast aside the traditional mindset associated with existing systems and overcame a plethora of challenges. The production method of the fiber chip aligns seamlessly with photolithographic manufacturing processes. This compatibility is anticipated to lower the hurdles of industrialization. Moreover, it presents distinctive application prospects in burgeoning fields like brain-computer interfaces, electronic textiles, and virtual reality. Looking ahead, the team is set to further strengthen collaboration, boost chip performance, and drive its large-scale production and widespread application.