As a frontrunner in the semiconductor foundry industry, TSMC is persistently increasing its investments in cutting-edge processes and packaging technologies within Taiwan, China. On January 22, the company is set to organize a media event in Chiayi, where it will make the grand unveiling of the Chiayi Advanced Packaging Test Plant Seven (AP7). Presently, the plant is in the equipment relocation stage and stands as TSMC's sixth facility dedicated to advanced packaging and testing.
