On January 13th, Beijing time, in line with a trade pact, TSMC is set to substantially ramp up its investment in the United States and undertake the expansion of more chip - manufacturing facilities. According to individuals with insider knowledge of the situation, TSMC has plans to construct no less than five extra wafer fabrication plants in Arizona. This move will effectively double the number of local factories, though the precise timeline for this investment remains undetermined. Since 2020, TSMC has already finished constructing one factory in the local area, and a second one is projected to start production in 2028. Earlier, TSMC had already pledged to build four more factories in the upcoming years, and now it has reached an agreement to build at least five additional ones. The newly - planned plants will primarily concentrate on the production of logic chips. Additionally, TSMC has also made a commitment to build two factories dedicated to the production of 'packaged chips'.