Recently, a collaborative effort between the team led by Huang Xian and Guo Rui from Tianjin University and Wang Hongzhang's group at Tsinghua University has yielded a groundbreaking "heat - shrink fabrication strategy". This innovative approach is built upon the integration of liquid metal circuits and thermoplastic films, marking a significant leap forward in the realms of flexible electronics and intelligent sensing.

In traditional methods, fabricating high - performance circuits on irregular 3D curved carriers has been plagued by a host of challenges. These include difficulties in achieving conformal adhesion (ensuring the circuit closely adheres to the object's surface), precise control over the circuit's formation, material compatibility issues (ensuring different materials work well together), and a lack of sufficient reliability. The newly proposed "heat - shrink fabrication strategy" effectively tackles these problems.

The relevant research findings were published in the prestigious journal Nature Electronics on January 12.