Nanjing Huadian Circuit Co., Ltd. has issued a public notice, revealing that its board of directors has thoroughly examined and greenlit a proposal to embark on the "High-Density Optoelectronic Integrated Circuit Board Project." The project entails setting up a wholly-owned subsidiary in the Jintan District of Changzhou City. This subsidiary will serve as an incubation hub for pioneering technologies like CoWoP (which could stand for a specific advanced technology term, here kept as is for lack of a common equivalent) and sophisticated processes such as mSAP (modified Semi-Additive Process).

The subsidiary will establish a comprehensive closed-loop system that spans the entire spectrum from "Research and Development (R&D) - pilot production - verification - to application." It will also integrate next-generation technologies, notably the fusion of optical and copper technologies. The primary objective of this project is to significantly bolster the product's performance in terms of signal transmission efficiency, power distribution effectiveness, and functional integration.

Once the technologies and processes have undergone rigorous testing and are deemed mature and suitable for industrial-scale deployment, a large-scale production line will be erected. The wholly-owned subsidiary will boast a registered capital of US$100 million, with the entire project slated for a total investment of US$300 million, to be executed in two distinct phases. Upon the project's full completion, it is anticipated to annually augment the production capacity by 1.3 million high-density optoelectronic integrated circuit boards and yield an additional revenue stream of RMB 2 billion.