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On January 9, Lion Microelectronics released a pair of announcements. Firstly, it declared the successful completion of its "Annual Production Project for 6 Million 6-Inch Silicon Polishing Wafers for Integrated Circuits." The remaining funds raised for this project, totaling RMB 18.4024 million, will be entirely redirected to finance the "Annual Production Project for 1.8 Million 12-Inch Semiconductor Silicon Epitaxial Wafers." Secondly, the company announced a postponement of the "Annual Production Project for 1.8 Million 12-Inch Semiconductor Silicon Epitaxial Wafers," with the anticipated date for reaching a predetermined usable state now set for December 2027. This delay is attributed to a downturn in the semiconductor wafer industry, suboptimal capacity utilization, and substantial pressure on profitability.
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