On the global stage, TSMC, Samsung, and Intel stand out as the three major companies that have either already accomplished or are on the verge of achieving mass production of the 2nm chip process. Japan's Rapidus, however, has its sights set on becoming the fourth such company by 2027. To realize this ambitious goal, Rapidus is making significant strides in arranging the entire industrial chain. In July 2024, the company successfully showcased a 2nm process wafer, marking a major breakthrough in the front-end process. Now, its attention has shifted to the back-end packaging and testing phase. According to Japanese media sources, Rapidus is planning to set up a 9,000-square-meter research hub at Seiko Epson's Chitose plant in Japan during the spring of 2026. This facility will kick off trial production for the back-end process, encompassing chip packaging and PCB circuit assembly.