On January 9, Tongfu Microelectronics made an announcement stating that the company intends to raise a maximum of 4.4 billion yuan through a private share placement. Following the deduction of issuance costs, the entire proceeds will be allocated to bolstering packaging and testing capabilities in burgeoning application sectors, including memory chips, automotive electronics, wafer-level packaging, high-performance computing, and telecommunications. Additionally, the funds will be utilized to replenish working capital and settle bank loans. The total number of shares earmarked for issuance will not exceed 455 million, with the issue price set at a minimum of 80% of the average trading price of the company's shares over the twenty trading days prior to the pricing reference date. The ultimate recipients of the share issuance will be jointly decided by the company's board of directors and the sponsor (lead underwriter), subsequent to obtaining approval from the Shenzhen Stock Exchange and completing registration with the China Securities Regulatory Commission.