Search
TFME: Plans to Raise No More Than 4.4 Billion Yuan through Private Placement, for Projects Such as Capacity Enhancement in Memory Chip Packaging and Testing
1 week ago /
Read about 0 minute
Author：小编
On January 9, Tongfu Microelectronics announced that it plans to issue A-share stocks to specific objects, with the total amount of funds raised not exceeding 4.4 billion yuan. The funds will be used for projects such as capacity enhancement in memory chip packaging and testing, packaging and testing in emerging application areas such as automotive, wafer-level packaging and testing, high-performance computing and communications, as well as to supplement working capital and repay bank loans.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
