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Shenzhen Rewo Micro Semiconductor Technology Co., Ltd. has recently successfully closed a Series A financing round, raising tens of millions of yuan. The investors in this round include prominent names such as CSC Capital, Westlake Venture Capital, and Nanshan Emerging Industries Investment. Established in 2021, the company is dedicated to the innovation and practical application of advanced semiconductor packaging technologies. It has developed a state-of-the-art packaging technology platform that caters to a wide range of semiconductor segment applications. Notably, it has pioneered the introduction of chemical I/O bonding technology to this field and has achieved an integrated process that encompasses semiconductor chip bonding, wiring, and module mounting.
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