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On January 5, Holintech issued a public announcement stating its intention to invest up to 760.5 million yuan in the 'Expansion Project for Mobile Phone Optical Lens Components and Semiconductor Packaging & Testing Business'. This strategic move centers on bolstering the company's existing operations in MEMS (Micro-Electro-Mechanical Systems) optical precision components and semiconductor chip FT (Final Test) probe businesses. It's worth noting that this expansion does not encompass the launch of new business ventures. The project will be situated in the Suzhou High-Tech Zone, occupying an area of roughly 50 acres. Its primary objective is to augment production capacity and enhance market competitiveness, thereby catering to the escalating market demand.
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