SK Hynix has made an official announcement, revealing that it will stage an exhibition themed "Empowering a Sustainable Future with AI Technological Innovation" at CES 2026, which runs from January 6th to 9th. At this event, the company will spotlight its cutting-edge memory solutions tailored specifically for AI applications.

One of the major highlights will be the world premiere of its next-generation HBM product - the "16-Layer 48GB HBM4". Alongside this groundbreaking offering, SK Hynix will also display the 12-layer 36GB HBM3E product. Moreover, visitors can expect to see AI server GPU modules from global customers that are integrated with this state-of-the-art technology.

In addition to the above, the exhibition will shine a light on low-power memory modules (SOCAMM2) designed for AI servers. These modules are part of a versatile memory product line optimized for AI applications, which also includes products like LPDDR6. Furthermore, SK Hynix will present its 321-layer 2Tb QLC product, a solution crafted to cater to the ever-growing demands of the AI data center market.