On January 6 (local time), SK Hynix made an exciting announcement: it will establish a dedicated customer pavilion at the Venetian Expo Center during CES 2026, a major tech event running from January 6 to 9 (local time). This pavilion is specifically designed to spotlight next-generation memory solutions meticulously crafted for the realm of artificial intelligence.

At this highly anticipated event, the company is set to make a groundbreaking debut of its 16-layer 48GB HBM4. This marks the first time this innovative product will be presented to the world. Alongside this, SK Hynix will also display its 12-layer 36GB HBM3E product, as well as showcase global customer AI server GPU modules that are outfitted with this HBM3E product. Moreover, the company has plans to exhibit other remarkable products, such as the low-power memory module SOCAMM2, which is tailored for AI servers.