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On January 6, SK Hynix revealed that from January 6 to 9 (local time), it would establish a dedicated customer exhibition area at the Venetian Expo Center during 'CES 2026' in Las Vegas, USA. This move aims to present its cutting-edge memory solutions tailored for artificial intelligence (AI) in a focused manner.
At the event, the company is set to make its debut of the next-generation HBM product, the '16-layer 48GB HBM4'. Additionally, it will showcase the 12-layer 36GB HBM3E product. Alongside these, the company will display AI server GPU modules sourced from global customers, all of which are equipped with this advanced HBM3E product. Moreover, SK Hynix will also exhibit its low-power memory module, SOCAMM2, specifically designed for AI servers.
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