Qualcomm Places Its Bets on TSMC's 3nm N3X Process for Crafting the Snapdragon X2 Elite Extreme Chip
2026-01-04 / Read about 0 minute
Author:小编   

In September 2025, Qualcomm unveiled the Snapdragon X2 Elite series PC computing platform. The flagship model within this series, the Snapdragon X2 Elite Extreme, leverages TSMC's cutting-edge 3nm N3X process. This makes it the world's inaugural Arm instruction set-compatible CPU, boasting a frequency that can soar up to an impressive 5.0GHz.

The chip is engineered with 18 cores in total. It encompasses 12 super cores, each with a base frequency of 4.4GHz, and 6 performance cores, capable of reaching a maximum frequency of 3.6GHz. Among these, 2 super cores can be pushed to an extraordinary 5.0GHz through overclocking. This powerhouse integrates the third-generation Qualcomm Oryon™ CPU, a brand-new Adreno™ GPU architecture, and the Hexagon™ NPU. Together, they deliver an AI processing capability that can peak at a staggering 80 TOPS.

The chip is also equipped to support LPDDR5x-9523 memory, offering a bandwidth of 228GB/s. Additionally, it is compatible with Wi-Fi 7, Bluetooth 5.4, and the X75 5G Modem-RF. When compared to its predecessor, the CPU's single-core performance has seen a 39% enhancement, while its multi-core peak performance has surged by 50%. The GPU performance has witnessed a remarkable 2.3-fold increase, all while achieving significantly optimized energy efficiency.

Devices powered by this chip are anticipated to make their debut in the market during the first half of 2026.