According to ZDNet, Samsung is currently in the process of developing a cutting - edge chip packaging architecture known as Side - by - Side (SbS for short). This innovative technology is anticipated to be integrated into future Exynos series processors, potentially ushering in significant advancements in smartphone heat dissipation capabilities and overall body design.

The SbS packaging design involves positioning the chip module and DRAM side by side in a horizontal orientation. Additionally, a heat - conducting block (HPB) is placed on top of them. This unique setup not only enhances heat dissipation efficiency but also contributes to a reduction in the overall packaging thickness.

Market analysts predict that the Exynos 2700 is likely to be the first processor to incorporate this new technology. On the other hand, the Exynos 2800, which is expected to have a broader range of applications, will be able to fully unleash its performance potential by adopting the SbS packaging.