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In the fourth quarter of 2025, TSMC officially kicked off mass production of its N2 (2 - nanometer class) process technology. For the first time, it has adopted GAA nanosheet transistor technology. This technological breakthrough brings about several significant improvements. It leads to a 10% - 15% increase in performance, a 24% - 35% reduction in power consumption, and a 15% - 20% rise in transistor density. Moreover, the process integrates low - resistance redistribution layers and ultra - high - performance metal - insulator - metal capacitors. These elements work in tandem to further elevate energy efficiency. The initial batch of chips is being manufactured at the Fab 22 wafer plant. Production is anticipated to scale up in 2026, which will undoubtedly cement TSMC's dominant position in the foundry market.
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