On December 27th, Mwei Co., Ltd. expressed its long-term optimism regarding the prospects of HBM (High Bandwidth Memory) technology localization. In the realm of semiconductor manufacturing, the company's high - selectivity etching equipment and hybrid bonding equipment are versatile enough to be tailored for various DRAM (Dynamic Random - Access Memory) process steps. This adaptability positions the company as a key provider of essential equipment, playing a pivotal role in facilitating the localization of HBM technology. In the semiconductor industry, localization means developing and producing technologies and products within a specific region, reducing reliance on foreign sources. HBM is a high - performance memory technology widely used in areas like artificial intelligence and high - performance computing. DRAM, on the other hand, is a common type of random - access memory used in computers and other electronic devices. The integration of Mwei's equipment into DRAM processes is a significant step towards achieving self - sufficiency in HBM technology within the local area.