According to a report by Benzinga, in November 2025, Jensen Huang, the CEO of NVIDIA, paid a visit to TSMC and voiced an urgent need for more cutting-edge AI chips. This move directly set off a fresh wave of factory-building activity at TSMC. In a bid to have more new production capacities up and running by 2026, TSMC has promptly asked upstream equipment suppliers to cut down on delivery times. The ripple effect of this "urgent order" has swiftly cascaded across the entire supply chain. It's anticipated that the trend of high-intensity shipments from related equipment manufacturers will persist at least until the second quarter of 2026. Presently, TSMC has fully embarked on a large-scale factory construction project. The Hsinchu and Kaohsiung factories are concentrating on building 2-nanometer production lines. Meanwhile, the Southern Taiwan Science Park (STSP) campus is also ramping up its 2-nanometer production capacity. The STSP Fab 18 is continuously expanding its 3-nanometer process, and in the Taichung Science Park, construction has already commenced on an even more advanced 1.4-nanometer factory. Beyond wafer fabrication, TSMC is also channeling its expansion efforts into the "advanced packaging" sector, with a particular focus on boosting CoWoS capacity to cater to the growing demand for AI chip development. Moreover, TSMC's inaugural wafer fab in Arizona, USA, has commenced mass production, with two additional factories in the pipeline. Industry experts forecast that TSMC's capital expenditure for 2025 is likely to range between $48 billion and $50 billion.