Intel's Pioneering Advanced Packaging Strategy: Merging 16 Compute Chips and 24 HBM5 High-Bandwidth Memory Modules into One Package - Chip

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Intel's Pioneering Advanced Packaging Strategy: Merging 16 Compute Chips and 24 HBM5 High-Bandwidth Memory Modules into One Package

1 day ago / Read about 0 minute

Author：小编

Intel Foundry Services has recently unveiled a concise video highlighting its cutting-edge packaging technology. The blueprint involves scaling up chiplet dimensions to a staggering 12 times the area of a conventional lithography field of view (around 830 square millimeters), leveraging Foveros 3D and EMIB-T interconnections. As per the details shared, this innovative approach enables the integration of up to 16 compute chips within a single package, complemented by 24 HBM5 high-bandwidth memory modules, thereby catering to the burgeoning demand for ultra-high-scale computing capabilities in the future.

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