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GRINM: Its Innovative Heat-Dissipating Copper Powder Finds Application in Huawei's Ascend 910B Chip
1 week ago /
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Author：小编
On December 23, news emerged that GRINM revealed in the investor relations activities record sheet that its newly developed heat-dissipating copper powder, created in collaboration with Huawei, has been incorporated into Huawei's Ascend 910B chip. At present, the share of civilian products within the company's 3D-printed powder materials lineup is relatively modest. Nevertheless, as the civilian markets for items like shoe molds, general molds, and prototypes continue to expand, the proportion of civilian products is expected to rise steadily in the coming years. Furthermore, GRINM Advanced Materials currently boasts a robust order book, with its production facilities operating at near-full capacity.
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