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In 2022, Rapidus emerged as a collaborative venture among eight Japanese giants: Sony, Toyota, NTT, Mitsubishi, NEC, Kioxia, and SoftBank. The company's lofty ambition is to spearhead the design and production of cutting - edge semiconductor processes within Japan. To bring this vision to life, Rapidus has constructed an Innovation Integration Manufacturing facility (IIM - 1) in Chitose City, Hokkaido, Japan. This state - of - the - art plant will serve as the production hub for 2nm chips, with mass production slated to commence in 2027.
In the contemporary semiconductor landscape, advanced packaging technology has taken on an increasingly pivotal role in chip development. Recognizing this trend, Rapidus has also boldly stepped into this burgeoning field.
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