On December 15, Jingjia Micro made an announcement stating that its edge-side AI SoC chip, the CH37 series—developed independently by its controlled subsidiary, Wuxi Chengheng Microelectronics—has successfully navigated through crucial phases such as tape-out (the final stage in the design of an integrated circuit before it is sent for manufacturing), packaging (the process of enclosing an integrated circuit in a protective casing), wafer return (the stage where the processed silicon wafers are sent back after fabrication), and power-on testing (the initial test to verify the functionality of the chip when power is applied). Extensive testing has verified that the chip's fundamental functions and core performance metrics, including computational efficiency, module coordination, and stability, align with the design specifications. This achievement signifies a significant step forward in the project's development. Moving forward, Chengheng Micro will expedite efforts in optimizing the chip's power consumption and conducting comprehensive performance evaluations to pave the way for its swift entry into mass production.