SK Hynix has placed an order with Singapore-based ASMPT for a new batch of thermo-compression bonders (TCB) for HBM4 production. Last month, it ordered seven TC bonding systems, each containing two bonding heads, priced at approximately KRW 4 billion per set, with a total contract value of around KRW 30 billion. Previously, ASMPT had already supplied dozens of TC bonder components for SK Hynix's HBM3E 12H production.
